With electronic devices and high performance products processing more in smaller volumes, we use heat spreading to manage high heat density sources. By enabling heat to access more surface area of a heat sink, chassis, or enclosure, heat spreading helps keep localized temperatures within device operating limits, maintains functionality and prolongs product lifetimes.

Boyd has several methods for effective heat spreading, including rapid heat transfer with two phase components like vapor chambers and heat pipes or high conductivity graphite. Our expertise in these technologies enables us to embed these heat spreading methods into your solution to enhance the performance of your thermal management solution.

Learn more about how these heat spreading technologies work. Compare performance levels of various heat spreading methodologies to aid in selecting the right technology for your application by viewing resources in the category tabs above:

As heat cannot be destroyed, we can only transport and dissipate it safely away from users and heat-sensitive components. Devices have only gotten more powerful and depend on reliable thermal management to maintain long product lifetimes and safe operation.

Boyd employs a variety of technologies to transfer heat, even over large distances. Two phase technologies like heat pipes are ideal for quickly transferring heat from one area to another, with loop heat pipes extending up to 75 feet from the heat source. We can also use solid conduction technologies like thermal straps, thermal interface materials, or busses to conduct heat through materials. Thermosiphon technologies enable us to transport heat with the aid of gravity, helping us remove heat with the natural buoyancy of fluids.

Diverting air or liquids through a system are common methods for convecting heat out of a system. Our broad array of air cooling solutions like heat sinks, fans, and blowers and liquid cooling solutions like liquid cold plates, heat exchangers, pumps, and liquid cooling systems are common solutions to remove heat from simple to complex solutions. Each of these systems maximize heat transfer, typically through balancing flow rate, pressure drop, and surface area to produce optimized solutions geared towards their specific end application.

Learn more about passive air cooling, active air cooling, passive liquid cooling, active liquid cooling, and radiation. See examples of how Boyd implements these techniques to transfer and dissipate heat in the category tabs above.

Compression refrigeration cycles enable us to cool below ambient temperatures, which can be critical for temperature-sensitive processes and materials.

Maintaining constant system temperatures requires tight control and feedback systems with sensors, electronic control units, and variable pumps, valves, and fans. Our engineers incorporate intelligence into these systems with active systems that react to changing environmental conditions.

Learn more about how sub-ambient cooling works, how to build complex liquid loops, system control options, and other methods Boyd uses for refrigeration systems by clicking the category tabs above.